Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium
Multiples:
1.0
Minimum quantity:
420.0
Product code:
374224B00035G
Manufacturer: BOYD CORP
Manufacturer code: 374224B00035G
Specification for Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium
| Material | aluminium |
| Application | BGA |
| Width | 23mm |
| Length | 23mm |
| Height | 25mm |
| Type of heatsink | extruded |