Specification for Module
| Case | SP1 |
| Electrical mounting | Press-in PCB |
| Mechanical mounting | screw |
| Semiconductor structure | transistor/transistor |
| Technology | FREDFET, POWER MOS 8® |
| Drain-source voltage | 600V |
| Drain current | 15A |
| Pulsed drain current | 125A |
| Power dissipation | 208W |
| On-state resistance | 230mΩ |
| Topology | H-bridge, NTC thermistor |