Specification for Tape: heat transfer; W: 50mm; L: 200mm; Thk: 1mm; 1W/mK; silicone
| Operating temperature | -40...200°C |
| Version | double-sided, glueless |
| Width | 50mm |
| Length | 200mm |
| Thickness | 1mm |
| Thermal conductivity | 1W/mK |
| Dielectric strength | 6kV/mm |
| Tape application | facilitates heat transfer, filling joints and micro-gaps between the processor and the base of the cooling system |
| Type of tape | heat transfer |
| Tape material | silicone |
| Shore hardness | 60±5 |