Specification for Module: diode
| Case | HALF-PAK |
| Electrical mounting | screw |
| Mechanical mounting | screw |
| Semiconductor structure | single diode |
| Max. off-state voltage | 400V |
| Max. load current | 210A |
| Features of semiconductor devices | ultrafast switching |
| Technology | HEXFRED® |
| Max. forward impulse current | 600A |
| Load current | 210A |
| Max. forward voltage | 1.23V |