Epoxy encapsulating compound; 100g; resin

    Multiples: 1.0
    Minimum quantity: 1.0
    Product code: ART.AGT-223
    Manufacturer: AG TERMOPASTY
    Manufacturer code: ART.AGT-223
    • Application
    • Mix ratio
    • Type of chemical agent
    • Appearance
    • Bonding time

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    Specification for Epoxy encapsulating compound; 100g; resin

    Application sealing and encapsulation of electronic circuits
    Mix ratio 100:10
    Type of chemical agent epoxy encapsulating compound
    Appearance resin
    Bonding time 60min