Silicone encapsulating compound; white; Temp: -50÷200°C; 20kV/mm

    Multiples: 1.0
    Minimum quantity: 1.0
    Product code: ART.AGT-262
    Manufacturer: AG TERMOPASTY
    Manufacturer code: ART.AGT-262
    • Operating temperature
    • Colour
    • Application
    • Thermal conductivity
    • Dielectric strength
    • Mix ratio
    • Agent features
    • Agent features
    • Net weight
    • Shore hardness
    • Type of chemical agent
    • Appearance
    • Available labels languages
    • Available labels languages
    • Available labels languages
    • Available labels languages
    • Available labels languages
    • Available labels languages
    • Available labels languages
    • Available labels languages
    • Available labels languages
    • Available labels languages
    • Available labels languages
    • Bonding time
    • Dielectric constant
    • Surface resistance

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    Specification for Silicone encapsulating compound; white; Temp: -50÷200°C; 20kV/mm

    Operating temperature -50...200°C
    Colour white
    Application sealing and encapsulation of electronic circuits
    Thermal conductivity 1.2W/mK
    Dielectric strength 20kV/mm
    Mix ratio 100:10
    Agent features condensation cure, two-component
    Net weight 1kg
    Shore hardness 59
    Type of chemical agent silicone encapsulating compound
    Appearance paste
    Available labels languages BG, CZ, EN, ES, FI, FR, HU, IT, PL, RO, SK
    Bonding time 30min
    Dielectric constant 3
    Surface resistance <2410TΩ