Heat transfer glue; epoxy resin; 20ml; Thermal Bonding System

    Multiples: 1.0
    Minimum quantity: 1.0
    Product code: TBS20S
    Manufacturer: ELECTROLUBE
    Manufacturer code: TBS20S
    • Kind of package
    • Thermal conductivity
    • Min. breakdown voltage
    • Agent application
    • Agent features
    • Name
    • Type of chemical agent
    • Grease ingredients

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    Specification for Heat transfer glue; epoxy resin; 20ml; Thermal Bonding System

    Kind of package syringe with A and B components
    Thermal conductivity 1.1W/mK
    Min. breakdown voltage 11kV/mm
    Agent application heatsinks
    Agent features two-component
    Name Thermal Bonding System
    Type of chemical agent heat transfer glue
    Grease ingredients epoxy resin