Specification for Heat transfer glue; phial; 5g; 2.2W/mK
| Kind of package | phial |
| Thermal conductivity | 2.2W/mK |
| Agent application | heatsinks |
| Agent features | heat-hardening adhesive , two-component |
| Type of chemical agent | heat transfer glue |
| Kind of package | phial |
| Thermal conductivity | 2.2W/mK |
| Agent application | heatsinks |
| Agent features | heat-hardening adhesive , two-component |
| Type of chemical agent | heat transfer glue |