Specification for Heat transfer glue; 0.836W/mK; -56÷149°C; Mix ratio: 10: 1; 30g
| Operating temperature | -56...149°C |
| Thermal conductivity | 0.836W/mK |
| Type of accessories for semiconductors | heat transfer glue |
| Mix ratio | 10:1 |
| Agent application | electronic equipment |
| Agent features | electrically non-conductive, two-component |