Specification for Epoxy encapsulating compound; 100g; resin
| Application | sealing and encapsulation of electronic circuits |
| Mix ratio | 100:12 |
| Type of chemical agent | epoxy encapsulating compound |
| Appearance | resin |
| Application | sealing and encapsulation of electronic circuits |
| Mix ratio | 100:12 |
| Type of chemical agent | epoxy encapsulating compound |
| Appearance | resin |