BGA reballing,
PCB heating before assembly and disassembly of components,
solder remowing
Soldering equipment features
3 sockets for connecting thermocouple,
adjustable stand in XYZ axes,
continuously adjustable airflow,
cooling function of the heating element after end of work,
microprocessor controlled,
quartz heaters,
real time paremeter modification,
three heating zones,
uniform temperature distribution over the entire surface,
unlimited number of memory temperature profiles